Wednesday, March 18, 2026

Samsung and AMD sign a preliminary deal for Samsung to supply its next-gen HBM4 for AMD's MI455X accelerators, used in data centers, and DDR5 for AMD's Helios (Yoolim Lee/Bloomberg)

Yoolim Lee / Bloomberg:
Samsung and AMD sign a preliminary deal for Samsung to supply its next-gen HBM4 for AMD's MI455X accelerators, used in data centers, and DDR5 for AMD's Helios  —  Samsung Electronics Co. agreed to supply and collaborate with Advanced Micro Devices Inc. on next-generation AI memory and computing technologies.



No comments:

Post a Comment

MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's, as the mobile chip designer bets on AI demand for growth (Cheng Ting-Fang/Nikkei Asia)

Cheng Ting-Fang / Nikkei Asia : MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's...