Friday, October 3, 2025

TechInsights: Huawei used components from TSMC, Samsung, and SK Hynix in some of its Ascend 910C chips; TSMC says the analyzed dies were made before Oct. 2024 (Mackenzie Hawkins/Bloomberg)

Mackenzie Hawkins / Bloomberg:
TechInsights: Huawei used components from TSMC, Samsung, and SK Hynix in some of its Ascend 910C chips; TSMC says the analyzed dies were made before Oct. 2024  —  Huawei Technologies Co. used advanced components from Asia's largest technology firms in at least some of its leading Ascend AI processors …



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Sources: SoftBank invites more banks to join its $40B loan backing its OpenAI investment, requiring them to commit ~$5B each; SoftBank has already invested $30B (Bloomberg)

Bloomberg : Sources: SoftBank invites more banks to join its $40B loan backing its OpenAI investment, requiring them to commit ~$5B each;...