Friday, May 9, 2025

Sources: CoreWeave plans to raise ~$1.5B through a high-yield bond offering, aiming to refinance part of its massive liabilities, weeks after a muted IPO (Financial Times)

Financial Times:
Sources: CoreWeave plans to raise ~$1.5B through a high-yield bond offering, aiming to refinance part of its massive liabilities, weeks after a muted IPO  —  AI data centre provider returns to investors with potential bond offerings that could reduce cost of borrowing



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MediaTek unveils the Dimensity 9600 Pro, its first phone SoC on TSMC's 2nm node, and the 3nm 9600M, with boosted AI performance, as it competes with Qualcomm (Wen-Yee Lee/Reuters)

Wen-Yee Lee / Reuters : MediaTek unveils the Dimensity 9600 Pro, its first phone SoC on TSMC's 2nm node, and the 3nm 9600M, with boos...