Financial Times:
Sources: CoreWeave plans to raise ~$1.5B through a high-yield bond offering, aiming to refinance part of its massive liabilities, weeks after a muted IPO — AI data centre provider returns to investors with potential bond offerings that could reduce cost of borrowing
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Friday, May 9, 2025
Sources: CoreWeave plans to raise ~$1.5B through a high-yield bond offering, aiming to refinance part of its massive liabilities, weeks after a muted IPO (Financial Times)
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MediaTek unveils the Dimensity 9600 Pro, its first phone SoC on TSMC's 2nm node, and the 3nm 9600M, with boosted AI performance, as it competes with Qualcomm (Wen-Yee Lee/Reuters)
Wen-Yee Lee / Reuters : MediaTek unveils the Dimensity 9600 Pro, its first phone SoC on TSMC's 2nm node, and the 3nm 9600M, with boos...
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Amid government scrutiny over its various trade practices, the firm has been able to hold on to a set of consumers looking for cheaper goods...
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