Friday, May 9, 2025

Sources: CoreWeave plans to raise ~$1.5B through a high-yield bond offering, aiming to refinance part of its massive liabilities, weeks after a muted IPO (Financial Times)

Financial Times:
Sources: CoreWeave plans to raise ~$1.5B through a high-yield bond offering, aiming to refinance part of its massive liabilities, weeks after a muted IPO  —  AI data centre provider returns to investors with potential bond offerings that could reduce cost of borrowing



No comments:

Post a Comment

MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's, as the mobile chip designer bets on AI demand for growth (Cheng Ting-Fang/Nikkei Asia)

Cheng Ting-Fang / Nikkei Asia : MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's...