Tuesday, March 4, 2025

TSMC's US investment is a win-win; dropping one advanced node protects its interests, while an advanced packaging plant and R&D center boost US chip prowess (Ming-Chi Kuo)

Ming-Chi Kuo:
TSMC's US investment is a win-win; dropping one advanced node protects its interests, while an advanced packaging plant and R&D center boost US chip prowess  —  TSMC's newly announced US investment plan, unveiled on March 4, 2025, differs from the original by adding $100 billion …



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MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's, as the mobile chip designer bets on AI demand for growth (Cheng Ting-Fang/Nikkei Asia)

Cheng Ting-Fang / Nikkei Asia : MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's...