Tuesday, August 6, 2024

The US awards South Korea's SK Hynix an initial $450M in grants and $500M in loans to build an advanced chip packaging facility in Indiana under the CHIPS Act (Bloomberg)

Bloomberg:
The US awards South Korea's SK Hynix an initial $450M in grants and $500M in loans to build an advanced chip packaging facility in Indiana under the CHIPS Act  —  - Firm to get $450 million Chips Act grant, $500 million loan  — Indiana facility focused on advanced packaging, research



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The US and China create a "Super Intelligence Dialogue" on AI risks and a separate AI incident hotline, likened to a Cold War-era "red telephone" (Ben Berkowitz/Axios)

Ben Berkowitz / Axios : The US and China create a “Super Intelligence Dialogue” on AI risks and a separate AI incident hotline, likened t...