Tuesday, August 6, 2024

The US awards South Korea's SK Hynix an initial $450M in grants and $500M in loans to build an advanced chip packaging facility in Indiana under the CHIPS Act (Bloomberg)

Bloomberg:
The US awards South Korea's SK Hynix an initial $450M in grants and $500M in loans to build an advanced chip packaging facility in Indiana under the CHIPS Act  —  - Firm to get $450 million Chips Act grant, $500 million loan  — Indiana facility focused on advanced packaging, research



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SK Group Chair Chey Tae Won says Anthropic has asked SK Hynix for supplies to make its own chips, calling it remarkable that an AI developer has chip ambitions (Ian King/Bloomberg)

Ian King / Bloomberg : SK Group Chair Chey Tae Won says Anthropic has asked SK Hynix for supplies to make its own chips, calling it remar...