Tuesday, August 6, 2024

The US awards South Korea's SK Hynix an initial $450M in grants and $500M in loans to build an advanced chip packaging facility in Indiana under the CHIPS Act (Bloomberg)

Bloomberg:
The US awards South Korea's SK Hynix an initial $450M in grants and $500M in loans to build an advanced chip packaging facility in Indiana under the CHIPS Act  —  - Firm to get $450 million Chips Act grant, $500 million loan  — Indiana facility focused on advanced packaging, research



at
Labels:

No comments:

Post a Comment

Subscribe to: Post Comments (Atom)

Topgolf and Puttshack founders' Poolhouse raised a $34M seed to build a "tech-enabled" version of pool, including via video projections and tracking players (Josh Noble/Financial Times)

Josh Noble / Financial Times : Topgolf and Puttshack founders' Poolhouse raised a $34M seed to build a “tech-enabled” version of pool...