Friday, July 26, 2024

The US Commerce Department says it signed a nonbinding preliminary agreement with Amkor for a CHIPS Act award consisting of $400M in grants and $200M in loans (Amy Edelen/Phoenix Business Journal)

Amy Edelen / Phoenix Business Journal:
The US Commerce Department says it signed a nonbinding preliminary agreement with Amkor for a CHIPS Act award consisting of $400M in grants and $200M in loans  —  Facility expected to create 2,000 jobs when in full operation within three years  —  The U.S. will award Amkor Technology Inc. $600 million …



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MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's, as the mobile chip designer bets on AI demand for growth (Cheng Ting-Fang/Nikkei Asia)

Cheng Ting-Fang / Nikkei Asia : MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's...