Thursday, April 11, 2024

An interview with DocuSign CEO Allan Thygesen on the company's new Intelligent Agreement Management service, now in beta, moving beyond e-signatures, and more (Richard Nieva/Forbes)

Richard Nieva / Forbes:
An interview with DocuSign CEO Allan Thygesen on the company's new Intelligent Agreement Management service, now in beta, moving beyond e-signatures, and more  —  In an exclusive interview with Forbes, Docusign CEO Allan Thygesen calls its new platform, which tackles contract management beyond …



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MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's, as the mobile chip designer bets on AI demand for growth (Cheng Ting-Fang/Nikkei Asia)

Cheng Ting-Fang / Nikkei Asia : MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's...