Wednesday, June 21, 2023

The US the EU Japan and India have committed over $100B combined for chip subsidies as chipmakers argue costs have risen due to inflation and tech advances (Bloomberg)

Bloomberg:
The US, the EU, Japan, and India have committed over $100B combined for chip subsidies, as chipmakers argue costs have risen due to inflation and tech advances  —  The global race to build domestic factories and sever dependency on overseas suppliers for these critical components is spurring a spending boom …



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MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's, as the mobile chip designer bets on AI demand for growth (Cheng Ting-Fang/Nikkei Asia)

Cheng Ting-Fang / Nikkei Asia : MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's...