Wednesday, June 21, 2023

The US the EU Japan and India have committed over $100B combined for chip subsidies as chipmakers argue costs have risen due to inflation and tech advances (Bloomberg)

Bloomberg:
The US, the EU, Japan, and India have committed over $100B combined for chip subsidies, as chipmakers argue costs have risen due to inflation and tech advances  —  The global race to build domestic factories and sever dependency on overseas suppliers for these critical components is spurring a spending boom …



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Finland, Canada, the US, and other countries are testing tech for passport-free travel, including facial recognition and a "digital travel credential" (Matt Burgess/Wired)

Matt Burgess / Wired : Finland, Canada, the US, and other countries are testing tech for passport-free travel, including facial recogniti...