Saturday, June 25, 2022

An interview with AMD's SVP Sam Naffziger on challenges facing the company, its coming RDNA 3 chiplet design, GPU performance and power efficiency, and more (Tom's Hardware)

Tom's Hardware:
An interview with AMD's SVP Sam Naffziger on challenges facing the company, its coming RDNA 3 chiplet design, GPU performance and power efficiency, and more  —  A look into the future RDNA 3 architecture  —  We recently had a chance to speak with Sam Naffziger, AMD's Senior Vice President …



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MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's, as the mobile chip designer bets on AI demand for growth (Cheng Ting-Fang/Nikkei Asia)

Cheng Ting-Fang / Nikkei Asia : MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's...