Monday, December 27, 2021

Samsung’s patent hints at a new foldable phone design

It seems like Samsung is looking to implement a third design into its foldable phone lineup, as the company was recently granted a patent for the same https://ift.tt/3mBNacq

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MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's, as the mobile chip designer bets on AI demand for growth (Cheng Ting-Fang/Nikkei Asia)

Cheng Ting-Fang / Nikkei Asia : MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's...