Friday, July 2, 2021

Xiaomi Working on Clamshell-Like Foldable Phone, Patent Suggests

Xiaomi latest patent has been spotted on China National Intellectual Property Administration (CNIPA). Sketches on the patent site shows the phone has thick bezels, clamshell-like folding design, and... https://ift.tt/3w6UQ8w
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MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's, as the mobile chip designer bets on AI demand for growth (Cheng Ting-Fang/Nikkei Asia)

Cheng Ting-Fang / Nikkei Asia : MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's...