Tuesday, June 15, 2021

Samsung unveils new multi-chip package for 5G smartphones

Samsung Electronics on Tuesday released a new multi-chip package (MCP) memory product for use in 5G smartphones as the South Korean tech giant tries to better target the fast-growing handset market. https://ift.tt/3xmGamz

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MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's, as the mobile chip designer bets on AI demand for growth (Cheng Ting-Fang/Nikkei Asia)

Cheng Ting-Fang / Nikkei Asia : MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's...