Monday, May 10, 2021

Amazon raises $1 billion sustainable bond for climate, social causes

The world's biggest company joins a growing list of debt issuers tapping the market for green and sustainable bonds, which is swelling as asset managers come under pressure from their investors to advance environmental, social and governance (ESG) causes. https://ift.tt/3uHOaOc

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MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's, as the mobile chip designer bets on AI demand for growth (Cheng Ting-Fang/Nikkei Asia)

Cheng Ting-Fang / Nikkei Asia : MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's...