Saturday, January 2, 2021

Huawei Tipped to Have HiSilicon Kirin 9010 As Its Next-Gen Flagship SoC

Huawei HiSilicon Kirin 9010 is said to be in the works as the company's next-generation flagship system-on-chip (SoC). The new chipset is speculated to be based on 3nm process technology. https://ift.tt/38WijPZ
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MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's, as the mobile chip designer bets on AI demand for growth (Cheng Ting-Fang/Nikkei Asia)

Cheng Ting-Fang / Nikkei Asia : MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's...