Wednesday, December 2, 2020

Qualcomm Snapdragon 888 Specifications Detailed, Kyro 680 CPU on Board

Qualcomm has detailed the specifications of the Snapdragon 888 SoC. The new chipset meant for flagship 2021 smartphones comes with third-generation Qualcomm Snapdragon X60 5G modem and Kryo 680 CPU.... https://ift.tt/3qnpOHJ

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MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's, as the mobile chip designer bets on AI demand for growth (Cheng Ting-Fang/Nikkei Asia)

Cheng Ting-Fang / Nikkei Asia : MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's...