Wednesday, March 11, 2020

Source: at least one of this year's iPhones will have a 3D depth camera on its back, enabling new photo and video effects, as well as better AR experiences (Mark Sullivan/Fast Company)

Mark Sullivan / Fast Company:
Source: at least one of this year's iPhones will have a 3D depth camera on its back, enabling new photo and video effects, as well as better AR experiences  —  Our source confirms Apple's plans to put a 3D depth camera on the back of the iPhone.  Here's what it'll do.



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MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's, as the mobile chip designer bets on AI demand for growth (Cheng Ting-Fang/Nikkei Asia)

Cheng Ting-Fang / Nikkei Asia : MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's...