Wednesday, March 4, 2020

HPE partners with AMD to use its chips in HPE's $600M US DOE supercomputer contract announced last August to optimize AI and ML for nuclear weapons support (Natalie Gagliordi/ZDNet)

Natalie Gagliordi / ZDNet:
HPE partners with AMD to use its chips in HPE's $600M US DOE supercomputer contract announced last August to optimize AI and ML for nuclear weapons support  —  This is the third US exascale win for Cray, which was recently acquired by Hewlett Packard Enterprise​ for $1.3 billion.



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MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's, as the mobile chip designer bets on AI demand for growth (Cheng Ting-Fang/Nikkei Asia)

Cheng Ting-Fang / Nikkei Asia : MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's...