Thursday, February 28, 2019

Samsung, Huawei agree to settle two-year old patent dispute

China's Huawei Technologies and South Korea's Samsung Electronics have agreed to settle a two-year old patent dispute in the United States, court documents show. https://ift.tt/2TeUeyg

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MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's, as the mobile chip designer bets on AI demand for growth (Cheng Ting-Fang/Nikkei Asia)

Cheng Ting-Fang / Nikkei Asia : MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's...