Sunday, November 11, 2018

Huawei testing Kirin 990 chip, may debut in Q1 2019: Report

Chinese tech giant Huawei is working on its next "Kirin 990" chipset with the Taiwan Semiconductor Manufacturing Company (TSMC) which is likely to be unveiled in the first quarter of 2019, the media reported. https://ift.tt/2PlPSEt
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Docs: Israeli AI chip startup Hailo is pursuing an urgent IPO via a SPAC merger at a valuation of less than $500M; it was last valued at $1.2B in 2024 (Meir Orbach/CTech)

Meir Orbach / CTech : Docs: Israeli AI chip startup Hailo is pursuing an urgent IPO via a SPAC merger at a valuation of less than $500M; ...