HMD Global has issued invites for a media event to be held in central London on October 4 where the Finnish brand could unveil the rumoured Nokia 7.1 Plus or Nokia X7.
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MediaTek says it has started to use Intel Foundry's advanced chip packaging in addition to TSMC's, as the mobile chip designer bets on AI demand for growth (Cheng Ting-Fang/Nikkei Asia)
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